Mitsubishi Electric qualifies 300mm power wafer line in Japan
Business news
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By
Nick Flaherty
Mitsubishi Electric has completed installation of its first 300mm silicon wafer processing line at its Power Device Work’s Fukuyama Factory.
Sample production and testing has verified that the power semiconductor chips processed on the production line achieve the required performance levels.
- Mitsubishi aims to dominate the power device business
- Mitsubishi doubles down on silicon-carbide with wafer fab
Mitsubishi Electric is planning to start mass production on the 300mm power silicon wafer line in fiscal 2025. The company aims to approximately double its silicon power semiconductor wafer processing capacity by fiscal 2026 compared to fiscal 2021 levels.
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