Mobile sector to drive advanced packaging
Advanced packaging, which includes flip-chip and wafer-level packaging (WLP), is set to experience a 7 percent compound annual growth rate over the period, from an annual market of $20.2 billion and 38 percent share of all packaging services in 2014 to one of $30 billion in 2020.
Annual revenue forecast by advanced packaging format 2014 to 2020. Source: Yole.
The market analysis company says the use of advanced packaging will be driven by the mobile sector, including smartphones and tablet computers, where space and weight are at a premum. Emerging applications are coming from the Internet of Things.
At Yole, we see an increased activity of Chinese capital in the advanced packaging industry," said Andrej Ivankovic, packaging and semiconductor manufacturing analyst at Yole, in a statement.
"The objective of the semiconductor transformation in China is to decrease external dependency and set up a complete internal supply chain that can serve domestic and international customers."
Fan-Out WLP is expected to make a major breakthrough within the next year, likely led by TSMC inFO PoP and followed by other Fan-Out multi die solutions.
Related links and articles:
Starting all over again on plastic: ARM
EDA tools support TSMC InFO 3D packaging
Fan-out wafer level packaging fills gap to 3D, says Yole
Startup goes multi-die to customize MCUs
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