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Modular analog and mixed-signal platform offers widest voltage range

Modular analog and mixed-signal platform offers widest voltage range

Technology News |
By Jean-Pierre Joosting



Built on a Bipolar-CMOS-DMOS (BCD) process on an advanced 65nm node, the onsemi Treo Platform analog and mixed-signal platform provides the foundation for a wide range of power and sensing solutions from onsemi including high-performance and low-power sensing, high-efficiency power management, and purpose-built communications devices.

The Treo Platform features a modular, SoC-like architecture with a robust set of ever-evolving IP building blocks that make up the compute, power management, sensing, and communications subsystems. Built on the 65nm process node, the analog and mixed-signal platform offers advanced digital processing capabilities and better analog IP performance. With these capabilities, the platform can deliver local intelligence and compute for flexible configuration, as well as significantly improve performance and accuracy in end applications.

Using this single, scalable platform, customers can simplify and accelerate product development for existing applications, and rapidly respond to emerging market opportunities. The analog and mixed-signal platform supports the industry’s widest voltage range of 1 to 90-V and operating temperatures up to 175°C, which allows customers to integrate a range of low-to-high power functionality. The platform will allow customers to simplify their design processes, reduce system costs and achieve faster time-to-market for their solutions in automotive, medical, industrial, and AI data centers. Products built on the platform will be manufactured at onsemi’s world-class 300mm fab in East Fishkill, NY.

Initial product families built on the Treo Platform are sampling today, including voltage translators, ultra-low-power AFEs, LDOs, ultrasonic sensors, multi-phase controllers, and single-pair Ethernet controllers. Through 2025, onsemi will deliver an even broader array of product families adding even more system-level value, including: high performance sensors, DC-DC converters, automotive LED drivers, electrical safety ICs, connectivity, and more. 

Increasing power demands in automotive, industrial, and AI data center markets in parallel with stricter environmental regulations are driving a need for greater energy efficiency at the same time these industries are requiring greater performance and functionality in end applications. Additionally, low power devices such as medical wearables are becoming more sophisticated, requiring more intelligence and better efficiency to improve personal care and reduce device costs. This creates the need for highly integrated, advanced power and sensing solutions capable of delivering greater intelligence while simultaneously delivering greater energy efficiency across the entire power spectrum. 

The Treo Platform is uniquely positioned to address these growing needs offering superior performance and features, while supporting the industry’s widest voltage range on a leading node. Products built on this analog and mixed-signal platform can achieve significant improvements in accuracy, performance and efficiency that result in an improvement in function, safety and overall quality of life. Examples include: 

  • In automotive, high-performance ultrasonic sensors can improve accuracy by a factor of two, meaning they can detect objects that are much closer to the vehicle than before in park assist applications. With the ability to detect objects at closer distances, the park assist system can provide better collision avoidance and improve overall safety by helping drivers avoid obstacles more effectively when parking.
  • In healthcare, ultra-low-power Analog Front Ends (AFEs) for continuous glucose monitoring (CGM) devices can more accurately measure very small electrical currents, down to the nanoampere (nA) level. This precision is crucial for detecting the tiny signals generated by glucose sensors, ensuring accurate glucose readings. By integrating multiple functions into a single, compact chip, the platform is able to cut the required footprint in half and extend the battery life to several weeks. This means the overall CGM device can be smaller and more comfortable for the patient to wear with fewer replacements to save on healthcare costs. 
  • In data centers, the Treo Platform will enable more compact onsemi smart power stages, contributing to efficiency improvements in power delivery to GPUs and CPUs. This can lead to reduced cooling requirements and substantial energy savings, resulting in lower operational costs and a smaller, more sustainable environmental footprint. 

www.onsemi.com

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