Modular system integration on flexible film substrates
Feature articles
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By
eeNews Europe
The main objectives are the integration of different electronic components and functionalities like batteries, displays, microcontroller ICs, sensors and passive components on a flexible substrate. The first motivation for a flex-to-flex integration concept is the potentially free form factor, which allows placing of film based systems on curved surfaces or in very thin housings.
Read the full article on page 42 of our June digital edition.
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