Modular XEON-based embedded PC for extreme environments
The PC has an 1151 processor socket and the Intel C246 chipset that support Intel 8th and 9th generation XEON and Core I processors: both 35 Watt CPU variants and CPUs with up to 80 Watts. Memory options include up to 32GB ECC or non-ECC DDR4 2666 MHz memory depending on the processor choice. Intel HD graphics are used to output to an HDMI, a display port and a DVI-I connection. Three 2.5″ installation bays are available, one of which is designed as a removable medium, two Mini-PCIe slots with mSATA support, one M.2 2242/2260/2280 slot with PCIe x4 signal, one M.2 2230, one PCI Express x16 and one x1 interface are accommodated in the 8.5 litre case.
The PCIe x16 slot and the case are designed for graphics card operation, making the MX1 suited for AI applications that use GPUs for calculation. The MX1 also features connection options for remote power ON/OFF and remote reset, allowing the MX1 to be situated in difficult to access locations. One Intel i219-LM and one i210-IT GbE LAN port, four USB 3.1, two USB 3.0, two USB 2.0, PS/2, two RS-232/422/485, two SIM card holders and three expansion bays are also available.
Available expansion modules are quad LAN with RJ45 with and without PoE+ functionality, quad LAN with M12 connector with and without PoE+ functionality, a dual RJ45 PoE+ module, an isolated quad combo RS-232/422/485 and 8-bit DIO interface and a Vehicle Power Ignition module.
The MX1 can operate in ambient temperatures from -40 °C to 70 °C, dependant on the CPU type. It also has EN50155 and E-MARK certifications for vehicle and railway operation. Input voltages are acceptable from 9 to 48 Volt DC, and the MX1 offers with reverse power control, overvoltage and overcurrent protection.
More information
https://www.icp-deutschland.de/index.php?stoken=27B5DEE9&lang=0&cl=search&searchparam=mx1-10FEP-D
https://files.icp-deutschland.de/produkte/KC002411/web/icp/MX1-10FEP-D-datasheet-20200403.pdf
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