More M2M communications with Cinterion’s EHS5 module

The module leverages the latest HSPA+ baseband developed by Intel aimed at low current consumption and industrial systems. With the same ultra-compact profile as the (‘2G’ GSM/GPRS) BGS2 module, this latest representative of the award-winning Cinterion Evolution platform offers high speed data communication with a downlink speed capable of 7.2 Mbps and uplink of 5.76Mbps.

With Cinterion’s specially developed LGA (Land Grid Array) design, the EHS5 is well suited to fulfil the manufacturing needs of both low and high-volume M2M devices with regard to reliability and efficiency. The module measures only 18.8×27.6×2.3mm and is suitable for both voice and data communications. The EHS5-E (900/2100 MHz) and EHS5-US (850/1900) enable global 3G coverage and will seamlessly fall back to Class 12 GPRS/EDGE when required.

Visit Avnet Embedded at www.avnet-embedded.eu