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MOSFET package variant for battery powered applications

MOSFET package variant for battery powered applications

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By Graham Prophet



The surface mount D²PAK 7pin+ package targets low voltage drives, battery powered tools and small electric vehicles, and extends options for selecting the ideal power device for many design challenges. The interchangeable pinout options of the package provide design flexibility. In comparison to the standard D²PAK 7pin package the new family offers up to 15% lower R DS(on) and up to 39% lower thermal resistance from junction to PCB.

 

The package is optimized to hold a die with an increased area of up to 20% while sharing the same footprint and pinout as a standard D²PAK 7pin. It can replace the traditional D²PAK 7pin and H²PAK packages. It package is designed with a threshold voltage at logic level which allows for driving the MOSFET directly from the microcontroller.

 

Infineon; www.infineon.com/strongirfet

 

 

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