MOSFETs in ultra-slim molded chip scale package designs

MOSFETs in ultra-slim molded chip scale package designs

New Products |
By eeNews Europe

Compared to existing CSP solutions the new family reduces package height by 50% and improves the overall mechanical robustness of the package. The performance enhancements offered by the MCSP technology, make these new devices ideal for the latest ultra-portable applications such as smart phones, tablet PCs, ultrabooks, and other mobile hand-held devices.     

The proprietary MCSP packaging technology encapsulates AOS’ low on-resistance MOSFET silicon in a protective Green (halogen-free) molding compound. The resulting product provides a thinner and more robust structure to solve die chipping and placement issues associated with standard CSP products. The new family of MCSP devices offers major performance benefits and at the same time can easily replace industry standard CSP devices by offering the same footprint, pin-out, and pitch.     

The new portfolio of MCSP products includes n- and p-channel devices with VDS ratings from 8 V to 30 V in package options of 0.97 mm x 0.97 mm and 1.57 mm x 1.57 mm.  AOC2414, AOC2421, and AOC2422 have guaranteed ultra-low on-resistance rated at 1.2 VGS which helps designers to simplify drive circuitry, lower power consumption and extend battery life in ultra-portable applications.     

Availability and Pricing     

All mentioned devices are available in production quantities with a lead-time of 12 weeks. The unit price for 1,000 pieces ranges from $0.23 to $0.30, depending on the device.      

More information about the MCSP devices at


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