The 3A and 5A modules contain the latest 600V super-junction MOSFETs to maximize energy efficiency. A choice of packages with inline or zig-zag leads helps optimize space savings and ensure required pin separation. Optional built-in slots allow simple mounting of low-cost heatsinks; separate open-emitter outputs ease PCB routing for single- or three-shunt current monitoring.
Each IPM contains a three-phase half bridge comprising six MOSFETs, with gate drivers implemented as high-voltage ICs. Additional integrated features simplify protection and fault prevention, including an uncommitted op-amp for current sensing, a comparator for high-speed fault protection, and an optional NTC (negative temperature coefficient) thermistor for temperature monitoring. A bootstrap diode is also integrated to reduce the bill of materials (BOM) and simplify board layout. Smart-shutdown circuitry protects the power switches, and under-voltage lockout (UVLO) prevents malfunction with low Vcc or Vboot.
The super-junction MOSFETs have low on-resistance, down to 1.0Ω or 1.6Ω (max.) at 25°C, as well as low capacitances and gate charge to minimize both conduction and switching losses. This enhances efficiency in hard-switching circuits operating up to 20 kHz, which includes a wide variety of industrial drives, and allows heatsink-free operation in low-power applications. Optimized switching di/dt and dV/dt ensure low EMI to help further simplify circuit design and layout.
The modules are specified up to maximum operating junction temperature of 150°C and are UL 1557 recognized, providing up to 1500 Vrms/min of isolation. Pricing is from $6.40 for the 3A STIPQ3M60T-HL in inline package or STIPQ3M60T-HZ with zig-zag leads.