The FDMF8811 module integrates a 120-V driver IC, a bootstrap diode, and two highly efficient PowerTrench power MOSFETs in a PQFN-36 package to cut board footprint by a third.
By integrating all of the key power components, the module maintains very high efficiency above 97 percent in full-bridge 600 W applications. The module’s design optimises driver and MOSFET dynamic performance, reduces system parasitic inductance, minimises the MOSFET RDS(ON), and reduces the switch ringing in converter applications. The driver IC features low delay time and matched PWM input propagation delays, which further enhance the device’s performance.
The 25 A module reduces the board area required for DC-DC converter designs by approximately one third compared to discrete implementations, enabling engineers to design smaller systems. The module also enables increased power delivery within existing available board area. The FDMF8811 is aimed at cloud applications such as wireless base stations, power modules, and onboard isolated DC-DC converters, as well as industrial applications such as motor drives, fans, and HVAC systems.