Moveable ground pin in QFP test & burn-in socket
Among such high density packages, the QFP combine high functional integration with excellent connection reliability. With its gull-wing shaped lead feet surface mount, QFP is most tolerant towards vibration, flexing, warping and other stress applied to the PCB. This mechanical reliability has been the reason why QFP is the first choice for industries that are operating in harsh conditions such as automotive. Beside of the connection reliability, issues like heat dissipation and RF property often require test sockets to be equipped with components that can handle cooling and grounding. The IC357 series offers no less than five different solutions to ground the QFP’s exposed pad either electrically or thermally or both in combination. The new design allows the center pin to actuate in conjunction with the movement of the push cover. While the push cover is being held down, the center pin retracts completely to allow the package to be guided into its position. When the push cover is released, lead foot contacts are actuated first holding the package firmly in its plane before the center pin comes into action. This two step actuation ensures that the IC357 series remains auto load capable and reliable for all future test and burn-in applications.
Visit Yamaichi Electronics at www.yamaichi.eu
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
