Multi-phase power chipset targets AI applications
Designers of high-performance, high-power AI systems can now achieve highest efficiency (to reduce power cost and heat) and smallest total system size with the MAX16602 AI cores dual-output voltage regulator and the MAX20790 smart power-stage IC from Maxim Integrated Products. Leveraging the current ripple cancelation benefit from a patented coupled inductor, this AI multi-phase chipset provides a one percent efficiency improvement compared to competitive products, enabling greater than 95 percent efficiency at 1.8 V output voltage and 200 A load conditions. Furthermore, this increase in efficiency translates to a 16% reduction in wasted power.
The chipset also allows 40 percent less output capacitance compared to competitive products, reducing total system size and capacitor count. The chipset is scalable for various output current requirements and is can be customized to support multiple form factors. In addition, the chipset enables AI computing at the edge as well as cloud computing at the datacenter.
Hyperscale datacenter designers grapple with increasing peak power and related higher thermal levels as they boost computing power to take on the rapidly rising demands of AI applications and deep learning. AI systems implemented with the MAX16602 and MAX20790 multi-phase chipset generate less heat compared to competitive solutions. Due to Maxim Integrated’s patented coupled inductor technology and monolithic integrated dual-side cooling power stage ICs, power loss is reduced as a result of a 50 percent lower switching frequency. The monolithic integrated approach practically eliminates the parasitic resistance and inductance between FETs and drivers to achieve the industry’s highest efficiency.
Space constraints also challenge designers as they seek to boost AI functionality. This chipset enables the smallest total solution size and allows developers to reduce component count and bill-of-materials (BOM) costs. Furthermore, Maxim Integrated’s low-profile coupled inductor technology supports higher saturation current per phase compared to a discrete inductor offered by competitive solutions. This allows designers to overcome space limitations by having lower phase count than competitors while also lowering the total cost of ownership.
The chipset is scalable from 2 to 16 phases for different output current requirements (thermal design current is typically 60 A to 800 A or more). A low profile (<4 mm) coupled inductor is customizable to support multiple form factors such as peripheral component interconnect express (PCIe®) and OCP accelerator modules (OAM).
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