Multilayer PCB material boost for network equipment

Multilayer PCB material boost for network equipment

Technology News |
By Nick Flaherty

Panasonic has launched a new material for multi-layer printed circuit boards for high-speed communication networking equipment such as routers and switches.

High-speed communication networking equipment, the backbone of Internet technology, will now need to meet 800 GbE (112 Gbps, PAM4) targets, which are twice as fast as the current 400 GbE standards. This can be a challenge for the materials in printed circuit boards as the increases in speed and frequency mean the transmission loss grows.

Rather than using a fluoropolymer-based circuit board material with polytetrafluoroethylene (PTFE), Panasonic combined its proprietary resin design expertise with ultra-low dielectric dissipation factor glass cloth and low-profile copper foil. This improves the dielectric properties of the material for the low transmission loss required for high-performance, high-layer-count circuit boards on existing PCB manufacturing lines.

The material reduces the transmission loss for this class of circuit board materials at 28GHz by 30 percent compared to the Megatron 7 R-5785(N) material, which Panasonic says in the lowest in the industry. The thermoset resin materal has heat resistance and reliability similar to the previous generation and so has the same manufacturability and processability as Panasonic conventional PCB laminate product and can be manufactured using standard multi-layer circuit board processes.

Megatron 8 is available with two types of glass cloth products.

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