Multilayer wiring substrate enables 2.5D integration of image sensors
New Products
|
By
eeNews Europe
This product in particular is designed to mount and connect an image sensor directly into a recess, making the complete camera module very slim. The multilayer wiring substrate is able to support high definition features and the narrowing pitch of pixels in camera sensors while retaining excellent noise immunity and high rigidity.
Visit Taiyo Yuden at www.taiyo-yuden.com
Related articles
CMOS-compatible intra-chip photonics brings new class of sensors
2.5D and 3D glass interposer US manufacturer receives $3.2 Million to fill market gap
Improved dielectric material for eWLB packages
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
