Multilayer wiring substrate enables 2.5D integration of image sensors

Multilayer wiring substrate enables 2.5D integration of image sensors

New Products |
Taiyo Yuden’s EOMIN copper-core multilayer wiring substrate allows for cavities to be formed that allow the integration of embedded-parts, very much akin to 2.5D active interposers, at a macroscopic scale.
By eeNews Europe

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This product in particular is designed to mount and connect an image sensor directly into a recess, making the complete camera module very slim. The multilayer wiring substrate is able to support high definition features and the narrowing pitch of pixels in camera sensors while retaining excellent noise immunity and high rigidity.

 

Visit Taiyo Yuden at www.taiyo-yuden.com

 

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