Multipurpose module captures IC failure
Forward-looking research indicates a fresh approach is needed for evaluating the reliability of copper lines and vias in advanced semiconductor processes.
New test techniques, such as constant voltage EM (CVEM), show great promise in complementing the traditional method of constant current EM (CIEM) stress. With MPEM, Cascade Microtech now provides the first commercial EM test to support this intriguing new CVEM evaluation method.
The new MPEM module provides multiple stress bias types for testing copper interconnects, typically with geometries of 32 nm or less. With MPEM, the company added constant voltage electromigration (CVEM) and low frequency pulsed current electromigration (LFPEM) applications to its existing lineup of constant current electromigration (CIEM) and stress migration capabilities.
Offering versatility by providing three types of EM tests in one convenient platform, customers can compare multiple test methods.
Additionally, the MPEM module effectively leverages the traditional advantage of Cascade Microtech’s EM solutions: a fully parallel, high-speed measurement system that is uniquely capable of capturing momentary, self-healing voids. The system offers a broad measurement range, with set points as low as 10uA or 10 mV.
Visit Cascade Microtech at www.cascademicrotech.com
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