Multitest offers extended temperature calibration to improve power dissipation control during test
More and more ICs such as graphic chips require a medium range power dissipation control for the DUT (device under test). For most of these applications heavy investment in established ATC (active thermal control) systems are not appropriate.
Multitest’s thermal expertise has enabled the company to develop a solution based on extended temperature calibration (XTC) for medium range power dissipation of up to 50 Watts. The die temperature inside the DUT is stabilized at a set temperature and a temperature drift after contacting is avoided.
The XTC is integrated into the conversion kit. Besides cost efficiency, this also ensures the full availability for any MT9510 pick-and-place handler in the market.
More information about Multitest’s XTC capability on its MT9510 at www.multitest.com/MT9510.
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