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NAND flash memory on 1xnm process technology

NAND flash memory on 1xnm process technology

New Products |
By Rich Pell



The new 1Gb-4Gb ML-3 SLC NAND Flash product family devices are designed on 1xnm, the industry’s most advanced technology node for SLC NAND products. Available with different interfaces, the first-generation Serial (SPI) SLC NAND and third-generation Parallel SLC NAND complete the company’s third-generation ML-3 4Gb-16Gb parallel SLC NAND product family already in production.

The new 1Gb-4Gb devices will be offered to support high-reliability systems that store critical data and operate at extended temperatures, up to +105°C. With its internal ECC engine, the ML-3 product family can support chipsets with as low as a 1-bit ECC engine to accommodate legacy chipsets and modern chipsets with higher ECC engines.

The ML-3 product family also offers various security features to protect sensitive boot code, system firmware, and application integrity from malicious software. The ML-3 product family devices are offered as ideal for high-reliable and/or secure applications, such as, industrial control, networking equipment, IoT applications, and set-top boxes.

“Our comprehensive ML-3 NAND Flash family offers high reliability and enhanced security, with both Serial and Parallel interface that high-performance applications require,” says GH Bae, CEO SkyHigh Memory. “Introducing this family fits in with our strategy to offer high-reliability and secure memories solutions for our fast-growing target markets, which are industrial, Networking and IoT.”

The ML-3 SLC NAND Flash devices provide two protection mechanisms traditionally not found in competitive SLC NAND products: a volatile and permanent block protection method. With the volatile block protection, the entire memory content can be protected. In this method, the protection parameter settings are volatile and therefore must be loaded to the device on power-up.

With the permanent block protection, protection parameter settings are permanent and programmed only once during the life cycle of the product. Up to 64Mb can be protected permanently. In addition, the ML-3 SLC NAND product family devices contain an OTP of 1Mb, the largest OTP of any SLC NAND in the market, says the company.

The ML-3 Serial (SPI) SLC NAND devices are available in an 8-pin LGA (6mm x 8mm) package that saves board space and simplifies board layout. The ML-3 Parallel SLC NAND offer a migration path to the first and second SkyHigh Memory parallel interface SLC NAND memory generation, with form and fit compatibility, and are available in industry-standard packages: 48-pin TSOP (12mm x 20mm) and 63-ball BGA (9mm x11mm).

The 2Gb and 4Gb ML-3 Serial (SPI) and Parallel SLC NAND Flash memory are available for sampling now. The 1Gb ML-3 Serial (SPI) and Parallel SLC NAND Flash memory will be available for sampling in January 2022.

SkyHigh Memory

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