Nanosilica-filled LED curable adhesive is biocompatible
Since this system does not need a UV light for curing it is intrinsically more user friendly. The nanosilica filler results in both lower shrinkage upon cure, as well as greater dimensional stability with a coefficient of thermal expansion of 35-40 in/in x 10-6/°C. The compound cures to a hardness of 65-75 Shore D and is optically clear, with a refractive index of 1.50. This electrically insulating system features a high volume resistivity of more than 1014 ohm-cm and a low dielectric constant of 4.2 at 60 Hz. It has good flowability with a viscosity of 2,000-8,000 cps and can be used for bonding, sealing and coating. LED405Med cures up to 0.125 inch thick and is suitable for small encapsulations involving optical assemblies or other sensitive components.
This no-mix system cures fully tack-free upon exposure to a 405 nm wavelength light source without any oxygen inhibition. In thinner sections, full cures can be achieved in 30-45 seconds.
Master Bond – ww.masterbond.com
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