XFMEXPRESS offers a new innovative connector and a new form factor measuring only 14mm x 18mm x 1.4mm, optimising mounting space without sacrificing performance.
XFMEXPRESS technology uses a PCIe 3.0, NVMe 1.3 interface with 4 lanes, bringing a theoretical bandwidth of up to 4 Gbyte/s in each direction, and up to 8GB/s in each direction for next-generation use cases. The new technology is PCIe 3.0 and 4.0, can be configured with 2 lanes to 4 lanes and can deploy current and future 3D flash memory sizes.
More information
www.toshiba-memory.com/en-jp/product/memory/xfmexpress
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