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New photoresist technology enables submicron organic semiconductor patterns

New photoresist technology enables submicron organic semiconductor patterns

Technology News |
By eeNews Europe



Low Power Techniques and Approach
Sandrine LEROY
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Current methods for patterning organic semiconductors include shadow masking and inkjet printing, but these patterning methods are not suitable for high-resolution patterning on large-size substrates. Photolithography would solve this issue, but the standard photoresists used for silicon semiconductors dissolve the organic semiconductor material during processing.

To go ahead with photolithography on organic semiconductor materials, Fujifilm and imec have combined their know-how, developing a new photoresist technology with Fujifilm’s synthetic-organic chemistry material design technology. Because the new photoresist can be used on existing i-line photolithography equipment, the new technology contributes to a cost-effective production of high-resolution organic semiconductor devices (at a submicron resolution).

For technical verification, Fujifilm and imec developed organic photo detectors (OPD) and organic light-emitting diodes (OLED) using the new photolithography technology, and tested their performance. Organic semiconductor materials were patterned to produce OPD composed of fine light receiving elements down to 200μm×200μm size. Generally, patterning of organic semiconductor materials degrades the property of converting light into electricity (photoelectric conversion property), but the OPD developed in this case were patterned without degradation. With respect to the OLED arrays that were produced using the newly developed photolithography pattering method: 20μm pitch OLEDs emitting uniform light, were realized.

Visit Fujifilm at www.fujifilm.com
Visit imec at www.imec.be

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