Neways buys Sencio for packaging tech

Neways buys Sencio for packaging tech

Business news |
By Nick Flaherty

Dutch equipment maker Neways has acquired the activities of Sencio for its advanced packaging for smart sensing and actuation applications.

Sencio will continue to operate under the brand Neways Advanced Microsystems and operate out of its current facilities in Nijmegen, the Netherlands, where it produces its technology in highly specialized cleanrooms.

“Over the past years Neways has invested significantly in its technology position, that allows us to act as innovation partner for the most demanding customers in the industry,” said Hans Büthker, CEO of Neways.

Neways builds a range of sub-systems and has more than 30 years experience in opto-electronics for sensing and detecting. The company integrates photonic components and modules into electronics, for example measuring optical wavefront quality or exact wafer positions in the heart of lithography systems. The company experience in opto-electronics goes beyond optical sensing and detecting for autonomous driving, high-speed data communication and medical imaging with expertise in chip-on-board assembly, miniaturization, material knowledge and ceramic substrate technologies.

“Through the acquisition of Sencio we further strengthen our market position in microelectronics and are able to offer a broader suite of integrated services to both Neways’ and Sencio’s customers. We welcome the Sencio team and are looking forward to our joint journey forwards.”

Oliver Maiwald, CEO of Sencio, added: “I am excited to become part of the Neways team and continue offering our technology with a large part of the dedicated and specialized Sencio team. Joining forces with Neways enables us to offer a complete suite of advanced microelectronics services to a broad set of customers that can benefit from advanced packaging for smart sensing and actuation applications.”

“Electronics systems continue to undergo greater miniaturization and higher integration. Unfortunately, this results in ever more complex testing and nowhere more so than for sensor systems,” he said.

“Unlike standard ICs, sensor systems also present an additional and unique challenge. Given their nature, they require customized encapsulation and packaging.  But that means there are no packaging standards and in turn there are no general testers and handlers available for sensor systems.”

“So as well as requiring customized encapsulation, each sensor needs its individual stimuli (light, pressure, current, temperature) and testing method. In general, the digital processing part of a sensor system can be tested directly on the wafer at the foundry. However, the sensor itself often cannot be tested because the package can have a direct impact on the sensor’s functionality,” he said.

 The implication is that the entire sensor system can only be tested and calibrated at the end of the production line. In fact the sensor system’s final functional production test, just like the  encapsulation requirements, needs to be considered right from the very beginning of development, and the Sencio’s plastic transfer moulding packaging ranges from exposed die through glass on die- molding up to multi-die chip packaging System in Package. It also developed a freeform packaging that can be accurately shaped and adapted to the exact requirements of a sensor.

Neways has over 3,000 specialists across the Netherlands, Germany, Slovakia, Czech Republic USA and China working on EV charging, electric power trains, digital health and sustainable agriculture.


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