News roundup from PCIM 2024

News roundup from PCIM 2024

Feature articles |
By Nick Flaherty

The PCIM power electronics exhibition in Nuremberg this week saw 637 exhibitors (60% international) showcase their latest products and innovations.

In total, over 18,000 visitors attended the PCIM 2024 exhibition, up from 16,500 last year and the 12,000 in 2022 recovering from the Covid-19 pandemic. There were 472 presentations on current research topics with 952 conference participants from 38 countries.

The show highlighted a  new generation of Intelligent Power Modules emerging using gallium nitride (GaN) for higher efficiency, smaller size and lower cost. Texas Instruments has developed its own GaN chips for a $5 module, while Qorvo is working on modules with Cambridge GaN Devices.

Qorvo set to go head to head with TI on GaN IPM power modules

Sustainability is always a key issue for power supply developers looking to increase the efficiency of their designs. For several years Infineon Technologies has highlighted its role in reducing greenhouse gas emissions by increasing the efficiency of power designs, but now it is detailing the actual carbon footprint of its devices, largely used in automotive applications.

The company plans to produce data for the rest of its devices in a move that will hopefully encourage other power device suppliers to do the same. This will give developers more accurate information on the carbon footprint of their designs across the entire value chain.

The move to solid state circuit breakers is one that has been slow to gain traction. Silicon carbide (SiC) MOSFETs can handle the currents required, but are large. Qorvo is aiming its SiC JFET devices acquired with United SIC at these designs with a low 4mΩ on resistance.

At the same time Menlo Micro is offering its MEMS power switch as a circuit breaker, with a side by side demonstration with SiC MOSFETs at the show.

Other highlights from the show include the latest research on 1200V GaN, Rohm’s SiC branding and plans for a 1400V IGBT from WeEn Semiconductors, Look out for a CEO interview with Markus Mosen of WeEn, a spin out of NXP, next week detailing its plans for SIC and silicon superjunction MOSFETs.

Third generation SiC for AI data centres, EV charging

Other news comes from CGD, Mitsubishi, Microchip and a new BridgeSwitch from Power Integration

The PCIM news ahead of the show is here.

The show in 2025 is a month earlier, running from 6th to 8th May, again in Nuremberg, Germany.

If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :    eeNews on Google News


Linked Articles