Rapidus installs Japan’s first EUV lithography for 2nm pilot line

Business news | December 18, 2024

Rapidus has started the installation of Japan’s first EUV lithography machine from ASML for a 2nm pilot line. The ASML…

$406m to boost US 300mm wafer supply  

Business news | December 18, 2024

The US government has awarded GlobalWafers a grant of $406m to boost 300mm silicon and silicon on insulator (SOI) wafer…

ICEYE tops $500m for radar satellites

Business news | December 18, 2024

Finnish radar satellite developer ICEYE has closed a $65m extension of the company’s earlier growth funding round of $93m The…

Airbus to make 100 OneWeb 5G LEO satellites in Iris2 move

Business news | December 18, 2024

Airbus Defence and Space is to build the extension of the OneWeb Low Earth Orbit (LEO) broadband satellite constellation for…

Nvidia, Verizon team on 5G edge AI

Business news | December 18, 2024

Verizon and Nvidia have developed an edge AI system that runs on Verizon’s 5G private network with private Mobile Edge…

Synopsys, Sima.ai team to build automotive edge AI silicon

Business news | December 18, 2024

Synopsys and Sima.ai are developing an end-to-end workflow for workload-specific silicon and software for…

NXP buys SerDes networking startup for $242m

Business news | December 17, 2024

NXP Semiconductors is to acquire US SerDes startup Aviva Links for $242.5m in cash. This is…

ZF project provides vehicle dual controls

Technology News | December 18, 2024

A student project at ZF in Birmingham, UK, is converting vehicle components to support…

Three team for holographic HUD production

Business news | December 17, 2024

Eastman, Ceres Holographics and Covestro have signed a deal for commercial production of holographic…

$4bn for Spanish battery gigafactory

Business news | December 16, 2024

European car maker Stellantis and CATL of China are to invest up to €4.1bn…

Tenstorrent powers first automotive RISC-V AI accelerator chiplet

Business news | December 12, 2024

BOS Semiconductors in Korea has developed the industry’s first RISC-V AI accelerator chiplet using…

Yunex Traffic, Autotalks teams on V2X security

Business news | December 18, 2024

Autotalks is working with Yunex Traffic on privacy and security capabilities on V2X Roadside…

Infineon boosts 4D radar range to 380m for driverless cars

New Products | December 18, 2024

Infineon Technologies is showing final samples of its scalable 4D imaging radar chip with…

65V, 2A buck LED driver for longer lighting chains

New Products | December 17, 2024

Diodes has launched an automotive-compliant synchronous Buck LED driver with high-side current sense drives…

SandboxAQ highlights cybersecurity milestones for 2024

Technology News | December 18, 2024

SandboxAQ boasts 18 cybersecurity publications with one on the security of SDitH accepted by…

Nvidia boosts Jetson range with Orin Nano Super

New Products | December 17, 2024

Nvidia has launched a Jetson Orin Nano developer kit with a focus on generative…

SiLC launches its first end product with LiDAR for industrial automation

Business news | December 18, 2024

SiLC Technologies has launched its first end product, a LiDaR laser line scanner for…

Axelera, Arduino team for edge AI

Business news | December 18, 2024

Dutch AI chip startup Axelera is working with Arduino to combine its AI accelerator…

Piezoelectric nanogenerators work in all directions

News | December 18, 2024

Structures such as 3D buckling have been widely used to impart stretchability to devices…

Shape-shifting antenna poised to transform communications

News | December 17, 2024

A shape-changing antenna would enable communications across a wider array of radio-frequency (RF) bands,…

How the latest sensors analyse body fluids

News | December 16, 2024

A new generation of wearable sensors will fundamentally change medicine. Researchers at ETH Zurich…

When Planar is Superior to Trench: An In−Depth Look at the Continued Evolution of Silicon Carbide MOSFETs

Heightened demand for silicon carbide (SiC) power devices in the electric vehicle powertrain and energy infrastructure is accelerating market growth.

Thermal Aging in Molded Power Inductors

The market demand to increase power density and efficiency in a smaller form factor, has pushed each element to its…

High Performance, Precision Analog Capability Enabled by the Treo Platform

This paper focuses on the analog capabilities which are part of the onsemi Treo platform.The PPA triangle concept is being…

Overcoming the Challenges of Silicon Carbide to Ensure Application Success, attached

Introduction Silicon has traditionally been the cornerstone of semiconductor technology. However, silicon has its limitations especially in power electronics, where…

The Engineer’s Guide
to 7 Space Tech Trends

The space race is intensifying. As commercial and scientific ambitions skyrocket, engineers face increasing pressure to deliver space-ready technology at…