Nexperia launches CFP15B BJTs for automotive and industrial use
The Netherlands-based Nexperia has introduced 12 new bipolar junction transistors (BJTs) in its clip-bonded FlatPower (CFP15B) package, offering a space-saving and cost-efficient alternative to traditional MJD-style devices in DPAK. The newly released MJPE-series targets demanding industrial and automotive applications where thermal performance and board space are both at a premium.
For eeNews Europe readers, this update underscores a key shift in packaging strategies. This has become an increasingly important topic as system designers seek to balance thermal management with tighter board layouts and cost controls, especially in power electronics for EVs and industrial automation.
Compact CFP15B BJTs
The new BJTs are available in both NPN and PNP variants, with VCEO ratings of 50 V, 80 V, and 100 V and collector currents (IC) of 2 A, 3 A, and 8 A. Nexperia has released six automotive-grade devices (such as the MJPE31C-Q) and six industrial-grade versions (e.g., MJPE44H11). All devices maintain thermal performance up to 175°C, a key specification for reliability in automotive environments.
By leveraging its clip-bonded CFP15B package, Nexperia has cut the soldering footprint by 53% compared to DPAK-packaged equivalents. The CFP package is already well established in Nexperia’s rectifier product lines, and its adoption here supports the company’s broader goal of standardizing footprints across device categories. This is likely to streamline PCB design and simplify inventory management for engineers.
Designed for Modern Multi-Layer PCBs
The CFP15B’s clip technology doesn’t just save space—it also contributes to enhanced electrical and thermal characteristics while improving mechanical robustness. This makes the package particularly well suited for complex power applications such as battery management systems (BMS), on-board chargers for electric vehicles, and display backlighting circuits.
“As the industry transitions to multi-layer PCBs, a trend driven by the increasing popularity of high-performance microcontrollers, packaging has become a crucial part of the thermal system,” said Nexperia’s Frank Matschullat (Product Group Manager Power Bipolar Discretes) in a release. “Modern CFP packaging technology, designed for multilayer PCBs, offers equal electrical performance in a considerably smaller footprint, helping to reduce part and overall system costs. Nexperia has substantially expanded its capacity to meet the increasing demand for CFP-packaged products that are essential for future-proofing automotive and industrial applications, including the MJPE series of BJTs.”
With the expansion of its BJT portfolio into CFP15B, Nexperia seems to be addressing both legacy DPAK designs and the evolving needs of modern, high-density power systems.
For more information about Nexperia’s portfolio of bipolar junction transistors, visit nexperia.com/MJPE.
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