Nexperia qualifies small-outline power FET package to automotive specs
LFPAK33 is an “SO-8-style” package in reduced size; it features a no-bond-wire construction with the FET die sandwiched in a leadframe for high thermal conductivity and low resistance and inductance. The resulting package has a footprint of 10.9 mm², and operating temperatures of up to 175oC Tj max are possible. Devices can handle up to 70A, and the product portfolio includes devices that range between 30 V – 100 V and an RDS(on) as low as 6.3 mΩ.
Target applications include: connected auto modules, next generation engine management systems; chassis and safety technology; LED lighting; relay replacement; C2X, radar, infotainment and navigation systems; and ADAS.
Nexperia; www.nexperia.com/products/automotive-qualified-products-q100-q101/automotive-mosfets/family/LFPAK33/
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