Next-Generation Microelectronics Manufacturing
DARPA is seeking collaboration that will shape the Next-Generation Microelectronics Manufacturing (NGMM) program – an effort to help usher in a new era of microchips and their future applications
With the NGMM program, DARPA intends to pioneer revolutionary science and technology achievements that will propel the next major wave in the manufacture of high-performance microelectronics – specifically, through three-dimensional heterogeneous integration (3DHI). Given the agency’s expectation that future innovation hinges on the fusion of diverse materials, devices, and circuits through advanced packaging, 3DHI will be key to U.S. technological leadership. The foundational goal of NGMM: to achieve national-level, 3DHI-driven breakthroughs comprising novel design and engineering.
The program is designed to establish a state-of-the-art, domestic capability for research, development, and production of 3DHI microelectronics at an existing location. This centralized 3DHI accelerator will focus specifically on advancing groundbreaking research, development, and collaboration, and will include an accessible pilot line for prototyping and early production of emerging microelectronics.
“Rapidly shifting geopolitics and the COVID-19 pandemic have highlighted the need for stronger domestic supply chains – including U.S. microelectronics R&D, fabrication, packaging, and assembly,” said Dr. Dev Palmer, NGMM managing director at DARPA. “Our goal is to strengthen long-term national security through trailblazing work in 3DHI that’s critical to technological superiority and sustains the U.S. competitive advantage.”
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