NGK teams for hybrid ceramic module substrates

NGK teams for hybrid ceramic module substrates

Business news |
By Nick Flaherty

A startup in Taiwan is developing ceramic substrates combined with rechargeable lithium ion batteries for optoelectronic and RF modules.

PanelSemi is developing ultra-thin flexible LED displays and substrates for semiconductor modules, and has teamed with NGK Insulators for high performance hybrid packaging.

PanelSemi has developed a tiled thin-film transistor (TFT) circuit fabrication technology for its displays and is now using this technology to develop a hybrid circuit board by fabricating fine wiring and functional circuits on polyimide film and integrating it with a ceramic substrate.

It is expanding its business to include high-performance circuit boards for semiconductor modules with large scale panel manufacturing for wireless communications and opto-electronic integration.

NGK has also invested an undisclosed sum into PanelSemi as part of its Road to 2050 strategy.

NGK is developing new technologies and products by combining PanelSemi’s circuit fabrication technology with NGK’s products, such as the ultra-compact and thin lithium-ion rechargeable EnerCera battery, ceramic substrates, and ceramic packages.

The HBS (HyBrid Substrate) developed by PanelSemi is an advanced integration technology platform, characterized by ultra-fine line width and spacing (L/S) features achieved through TF (Thin Film) and PLP (Panel Level Packaging) processes. The deal with NGK opens up ceraimic substrates for higher power and thermal applications.

This enables high-density interconnection, serving dual roles as an interposer and package substrate in advanced packaging. The top die is seamlessly bonded directly to the HBS.;

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