No date given for Samsung to supply Preferred Networks’ 2nm chips
Samsung Electronics has said it will provide 2nm chips and 2.5D advanced packaging to Japanese AI company Preferred Networks but has not said when it will do so.
Samsung said Preferred Networks is looking to develop AI accelerator components that support generative AI. Samsung said it will provide components made up from 2nm chiplets and advanced packaging but did not say when or what flavour of 2nm process would be used.
Samsung has already launched its SF2 2nm process saying it will be in mass production for mobile products in 2025 and 2026, in other words optimized for power consumption. The SF2X process, aimed at AI applications, is not due to be in mass production until 2026. And the addition of back-side power distribution is not due until 2027 (see Samsung unveils 2nm and 4nm process nodes, AI platform).
Meanwhile rival foundry TSMC is said to be starting risk production for Apple right now (see TSMC begins trial 2nm production for Apple, say reports).
Samsung did introduce gate-all-around (GAA) nanosheet technology in its 3nm manufacturing process node, ahead of TSMC and so is claiming its 2nm process bolsters a lead in that area.
The 2.5D I-Cube S technology included in the support offering, is a heterogeneous integration package technology, with multiple chips in one package. The silicon interposer was designed by design services company Gaonchip.
“We are excited to lead in AI accelerator technology with Samsung Electronics’ 2nm GAA process. This solution will significantly support Preferred Networks’ ongoing efforts to build highly energy-efficient, high-performance computing hardware that meets the ever-growing computing demands from generative AI technologies, especially large language models.,” said Junichiro Makino, a chief technology officer at Preferred Networks in a statement issued by Samsung. Again there is no mention of when the chips will arrive.
“This order is pivotal as it validates Samsung’s 2nm GAA process technology and advanced package technology as an ideal solution for next-generation AI accelerators,” said Taejoong Song, head of the foundry business development team at Samsung.
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TSMC begins trial 2nm production for Apple, say reports
Samsung unveils 2nm and 4nm process nodes, AI platform
Rapidus expands IBM deal to cover chiplet packaging
Backside power key to Intel 20A process
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