NXP strips down i.MX 8XLite for secure industrial IoT
NXP is launching a stripped down i.MX8 processor with added security for industrial IoT applications as well as V2X vehicle communication systems
The i.MX 8XLite applications processor, set to ship next year, has single and dual core options with ARM’s Cortex M4F floating point core and one or two Cortex A35 application processor cores. These communicate through a secure mailbox through a hardware firewall. The single A35 core version can be used for telematics designs, with the dual A35 version for V2X with the same footprint and pinout. There is also an optional power management (PMIC) chip to manage the processor and peripherals such as a cellular modem.
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“The i.MX 8XLite SoC offers the security and performance needed to expand the safety benefits of V2X into entry level vehicles and into exciting new realms of unmanned industrial delivery and drone applications,” said Dan Loop, General Manager, Automotive Edge Processing at NXP.
“We have removed a lot of the multimedia [blobks used] for infotainment and the instrument cluster and added security,” said Loop. “V2X requires a high level of performance for signature ID for keys and a vehicle will have to interact with up to 2000 vehicles, which means handling 2000 signature authentications every second. The V2X accelerator manages that authentication process in a generic way for any V2X system as there are different algorithms in China and ECDSA in US and Europe with cellular V2X or 802.11p.”
The chip also adds NXP’s integrated EdgeLock security and is targeted to meet FIPS 140-3 while simultaneously executing highly complex cryptography and processing telematics data. FIPS 140-3 is a U.S. government security standard for cryptographic modules used in a variety of applications, including V2X and critical infrastructure applications.
Some interfaces have been removed such as MIPI, with Ethernet and control area networking (CAN) interfaces for industrial vehicle management, building control and safety systems, solar power generation, EV charging stations, access controllers and more. A PCI Express 3.0 interface is used to link to a 4G or 5G modem.
The chip is built on the same 28nm FDSOI process technology from Samsung as other i.MX8 parts but there is a future roadmap for performance, says Loop. Customers have early samples of the chip which is planned for launch in Q2 2022.
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