NXP Semiconductors has collaborated with Murata to deliver the industry’s first RF front-end modules designed with the latest Wi-Fi 6 standards. Together, the companies are delivering a product that can reduce design times, improve time-to-market and save board space in next generation Wi-Fi 6 implementations.
The NXP FEIC is tightly packed in a chip scale package (CSP) suitable for module integration and can support various 5G smartphones and portable computing devices. Additionally, it enables high performance 2×2 multiple input multiple output (MIMO) functionality.
“NXP’s monolithic front-end ICs are fully verified in leading Wi-Fi 6 platforms and offer perfect flexibility in terms of size and integration,” said Katsuhiko Fujikawa, R&D Manager of Murata Manufacturing Co., Ltd. “We plan to continue working with NXP and hope to develop newer modules in forthcoming years that support new spectrums and standards.”
“Working with Murata helps manufacturers deliver a highly integrated, fully tested and qualified solution for 5G devices while providing the highest performance and smallest size to meet rapidly rising global demand for Wi-Fi 6,” said Paul Hart, Senior Vice President and General Manager of NXP’s Radio Frequency business.
Wi-Fi 6 delivers a wealth of additional connectivity improvements, including symmetric multi-gigabit uploads and downloads, dramatically lower latency, increased capacity, and improved power efficiency across applications. These technical advancements have so far been limited to premium products. However, with NXP’s broad portfolio, these benefits are now available for large-scale deployment across multiple markets, enabling products with today’s most advanced Wi-Fi capabilities, including up to 4x performance improvement, greater range, improved battery life, and greater connection reliability.