
NXP teams with Foxconn on next generation vehicle designs
NXP Semiconductors has signed a memorandum of understanding with Hon Hai Technology Group (also known as Foxconn) to jointly develop platforms for a new generation of smart connected vehicles.
Foxconn is the world’s largest electronics manufacturer and will use NXP’s portfolio of automotive chips and software for electric and connected vehicles, starting with an initial digital cockpit partnership based on the NXP i.MX applications processors and NXP Software Defined Radio platform. Foxconn also has a deal with European car maker Stellantis which uses NXP devices.
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The deal will expand to NXP’s S32 processors and analog-front-end, drivers, networking and power products. Another priority is connectivity designs using the latest NXP S32 domain and zonal controller family for gateways and vehicle networking control, while also advancing secure car access with ultra-wideband (UWB) and Bluetooth Low Energy (BLE).
A third pillar is safe automated driving using NXP’s radar. NXP will also offer hardware and software support and will use its third party ecosystem in the areas of electrification, connectivity and automation.
“Foxconn sees the disruptive challenges and the potential for innovation in today’s automotive industry. This is a prime opportunity for our particular electronics expertise,” said Young Liu, Chairman of Foxconn. “NXP’s longstanding expertise and leadership in automotive, its innovative products and its laser focus on safety, security and quality provide the foundation for the collaboration we are activating today.”
“We are proud to join forces with Foxconn today to support its ambitious leap into automotive and to jointly address the challenges and opportunities of a new generation of smart connected vehicles, especially Foxconn’s new electric vehicle platform,” said Kurt Sievers, President and CEO of NXP Semiconductors. “The auto industry must become faster and more efficient, and NXP is pleased to extend its technology portfolio to enable electrification, next generation architectures, smart and secure car access systems and more.”
As well as moving into the electric car making business, Foxconn has been moving into the chip business itself, buying a fab from Macronix for power devices and investing in the recovery of Chinese chip maker Tsinghua Unisoc and setting up a joint venture with Yageo called Xsemi.
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