Octavo doubles up SiP system in package integration

Octavo doubles up SiP system in package integration

Technology News |
By Nick Flaherty

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Packaging pioneer Octavo is looking to combine two of its systems to boost the integration.

Octavo developed two types of SiP for the STM32MP2 processor with embedded AI. The OSD32MP2-PM (processor module) mounts the MP2 processor onto the DDR4 DRAM with a footprint of 9 x 14mm. The second uses the bare processor die and DRAM with power management in a package measuring 21 X 21mm.

The company is looking at replacing the DRAM and processor die in the 21 x 21mm module with the MP SiP, freeing up the space occupied by the ST processor. This could be used for a wireless chip, FPGA for power management chip, says Erik Walsh, CTO of Octavo

“It’s a new architecture,” Walsh tells eeNews Europe. “The IC leaves a big space and we are looking at the things we can do there.”

Samples of the OSD32MP2-PM will be available at the end of 2024, with the OSD32MP2 samples following in early 2025, so any developments will be after that, but the company is looking to standardise on the 21 x 21mm footprint.





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