Octavo, TI team for ARM-based SiP with FPGA
Octavo Systems is developing a family of system in package (SiP) devices based around the AM623 and AM625 processors from Texas Instruments that can include a small FPGA.
The OSD62x SiP is aimed at small human-machine interface (HMI) applications for building automation, industrial control, IoT gateways, artificial intelligence (AI) at the edge, as well as many other low-power systems requiring high performance Linux processing.
The SiP integrates high-speed memory, power management and passive components alongside four ARM Cortex A53 processor and M4F cores a single BGA package rather than a module, reducing board space by up to 60%.
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The OSD62x SiP family will be offered in two package options. The first Maximized Integration (-MI) option, provides everything needed for an AM62x-based system in a 22mm x 22mm, 1mm ball pitch BGA.
The MI option includes the TI AM62x processor with a 1.4GHz quad Cortex-A53 and 400MHz Cortex-M4F microcontroller core with LPDDR4 High Speed Memory, power management, oscillator, EEPROM and passives.
There are also options for a small programmable logic device (FPGA/CPLD), Real-Time Clock (RTC), and Analog to Digital Converter (ADC).
The second Size Optimized (-SO) package provides customers the smallest AM62x-based module form factor at 14mm x 9mm in a 0.5mm ball pitch BGA.
The SO option integrates the TI AM62x processor with the same processor cores, memory and passives.
“Size constrained customers engaging with Octavo Systems need the smallest form factor module possible to enable their next generation designs, while others need the ease-of-use, low-cost PCB design rules, and supply chain management that a highly integrated AM62x-based System-in-Package enables. Providing the -MI and -SO options gives customers the flexibility to select the best solution for their application,” said Greg Sheridan Vice President Strategy and Marketing at Octavo Systems.
Octavo Systems is currently in development of the OSD62x with samples scheduled to be available by the end of 2023.
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