On the photonics roadmap: chip-to-chip and intra-chip interconnects
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By
eeNews Europe
Among the many lectures running in parallel, my bet was that a whole afternoon session on photonics would fill-up my curiosity on the topic. The different presenters all acknowledged that copper alone would not suffice to match the speed and data density required by future generations of consumer devices, with data streams expected in the TeraFLOPS range.
Read the full article on page 10 of our July/August digital edition.
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