One-stop-Shop from IC design to silicon tape out
Established to increase the competitiveness of Leti’s industrial partners, Silicon Impulse provides immediate access to Leti’s and CEA-List’s advanced IC technologies and systems expertise. It also leverages Leti’s extensive experience in technology transfer. Collaboration between Leti and List experts and ecosystem partners aims to shorten time to market from idea to production. This process includes prototyping and pre-production runs utilizing Leti’s advanced industrial infrastructure from concept to production hand-off.
Silicon Impulse offers its partners the full range of Leti and List’s expertise in analog, RF, digital and memory design and hardware/software-integrated solutions at the technology node that most cost-effectively meets their needs.
The IC competence center combines Leti’s large portfolio of leading-edge technologies and novel low-power design solutions with a unique service for speeding integration of Fully Depleted Silicon-on-Insulator (FD-SOI) and many other more advanced technologies (ReRAM, MEMS, 3DVLSI, Silicon Photonics), enabling heterogeneous low-power co-integration. These services are targeted to enable the rapidly emerging third-generation information-acquisition and processing devices that are key to the Internet of Things.
Specific features of the offer include:
· Leti’s pool of expertise in advanced IC design and low-power technologies
· Leading-edge IC technologies for application-oriented device, circuit and system solutions
· Regularly scheduled MPW shuttles for silicon prototyping and small-volume runs
· An established high-tech supply chain to accelerate production ramp-up and hand-off
· Customized collaboration to fit partner needs
Leti’s experts will collaborate with partners from the feasibility-study stage through device design, prototyping, testing and production ramp up. The wide range of IC technologies available in the platform is further augmented by List’s comprehensive embedded software solutions.
Visit CEA-Leti at www.leti.fr
Related news:
Monolithic 3D integration beats next node
CEA-Leti develops 16nm self-aligned split-gate memory cell
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
