Aries Embedded has launched a system-in-package (SiP) with the multicore STM32MP1 ARM processor from ST Microelectronics for industrial and IoT designs.
The MSMP1 brings one or two ARM CortexA7 processor cores (up to 800 MHz) with a Cortex M4 microcontroller core (up to 209 MHz) in the latest Open Standard Module (OSM) standard from SGET.
“Almost all functions of the CPU are available on the small board measuring only 30 by 45 mm,” said Andreas Widder, Managing Director of Aries Embedded. “The 476 contacts of the SiP module allow the CPU to be used transparently in demanding applications. It features low power consumption, small form factor, and competitive cost.”
- SGET boosts OSM embedded module standard, launches design guide
- First samples for RISC-V and ARM embedded modules
- RISC-V reference design for Intel FPGA module
- FPGA-based System-on-Module supports various softcore CPUs
The system-in-packages support 512 MB to 4 GB DDR3L RAM and 4 to 64 GB eMMC NAND Flash. The numerous interfaces include 10/100/1000 Mbit Ethernet, USB2.0 host/OTG, 2x CAN, UART, I2C, SPI, ADC/DAC, as well as a parallel display interface and camera input. The modules are available in the commercial temperature range, with 0 °C to +70 °C, as well as in the industrial temperature range, with -40 °C to +85 °C.
The MSMP1 modules are scalable in terms of performance and memory expansion and can be individually adapted to many project requirements.
Samples of the MSMP1 SiP will be available from the third quarter of 2022 and Aries Embedded will start series production in the fourth quarter of 2022.