OSM specification for postage stamp-sized COM boards
OSM was developed to define one of the first standards for directly solderable and scalable embedded computer modules. It is intended to replace credit card-sized modules with postage stamp-sized ones. The new specification standardizes the footprint and interface set of low-power application processors based on MCU32, ARM and x86 architectures across different sockets, manufacturers and architectures.
“OSM modules give ODMs and OEMs an ultra-miniature form factor with attractive pricing and high scalability. Since the modules are application-ready and come with all necessary software drivers and BSPs, and since the specification is open source – both in terms of the hardware and software – we expect them to be of high interest for the globally active embedded and IoT system development community,” explains Martin Unverdorben, Chairman of the SGET STD.05 Standard Development Team, which started work in October 2019.
OSM modules are intended to simplify and quicken the design-in of processors. It also helps make applications processor-agnostic to become scalable and future-proof, as well as protecting NRE investments. The OSM specification also provides an extra level of ruggedness with a BGA design and automated SMT.
All OSM modules are published and licensed under Creative Commons Plus (CC+) dual license. CC+ allows an open licensing model, such as the Creative Commons Attribution-ShareAlike license (CC B-SA 4.0) for a defined set of materials, components and software, and a commercial license for everything not included in this set. This is intended to ensure development data, such as block diagrams, libraries and BOMs resulting from the development of OSM modules, are publicly available. It is still possible to license the IP of a carrier board design commercially without violating the open source idea.
The new OSM specification expands SGET’s portfolio of module specifications with solderable BGA mini modules that are smaller than previously available modules. Even the largest OSM module, measuring 45x45mm, is 28% smaller than the µQseven (40x70mm), a standard also hosted by SGET, and 51% smaller than SMARC (82x50mm). Other module sizes in the new OSM specification are even smaller: OSM Size-0 (Zero) has the smallest footprint with 188 BGA pins on 30x15mm. OSM Size-S (Small) measures 30x30mm with 332 pins, OSM Size-M (Medium) offers 476 pins on 30x45mm, and Size-L (Large) measures 45x45mm with 662 BGA pins. SMARC, by comparison, specifies 314 pins and Qseven 230.
Detailed feature set
Interfaces vary in type and design depending on the size of the OSM modules. In maximum configurations, OSM modules provide all functions that make up an open programmable embedded, IoT or edge system, including GUI. Modules from Size-S upwards offer video interfaces for up to 1x RGB and 4-channel DSI. Size-M modules can additionally support 2x eDP/eDP++, and Size-L adds 1x LVDS interface for graphics. So all in all, maximum configurations can provide up to 5 video outputs in parallel. All modules from Size-S upwards further offer a 4-channel Camera Serial Interface (CSI). Size-L modules provide up to 10 PCIe lanes for quick connection of peripherals; Size-M offers 2x PCIe x1, and Size-S 1x PCIe x1. In view of their extremely miniaturized footprint, Size-0 modules do not feature any of the I/Os mentioned so far, but offer all the interfaces listed in the following. The OSM specification provisions up to 5x Ethernet for system-to-system communication.
In addition, all modules have what is called a communication area, providing 18 pins for antenna signals for wireless communication or the integration of field buses. Next, there are up to 4x USB 2.0 or 2x USB 3.0 (only in Size-L), up to 2x CAN, and 4x UART. Flash storage media can be connected via UFS. Up to 19 pins are further available for manufacturer-specific signals. Finally and to complete the feature set, there are up to 39 GPIOs, SPI, I2C, I2S, SDIO and 2x analog inputs. As a safeguard for the future and to ensure that any future expansions are backward compatible, up to 58 pins are reserved for future purposes.
More information
https://sget.org/standards/osm/
Related news
PICMG ratifies MicroSAM module format for smart sensors
Chronocam: Event-based sensing enables machine vision solutions
AI kit based uses Sparse Modelling for easy training
congatec shows full range of edge devices at embedded world
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
