According to the vendor, the new power MOSFET achieves class leading low ON-resistance by mounting a chip fabricated with Toshiba’s U-MOS VI trench process in a TO-220SM (W) package, which utilises a Cu (copper) connector. The low ON-resistance of the new product contributes to reduced conduction losses in electronic devices.
The TJ200F04M3L offers absolute maximum ratings of VDSS = – 40V, ID = – 200A and RDS(ON) Max = 1.8m Ω at VGS = 10V. The power MOSFET is capable of operating at a maximum channel temperature of 175°C.
For more information visit www.toshiba.semicon-storage.com
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