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Packaging innovations yield smaller, more robust 650V and 800V MOSFETs

Packaging innovations yield smaller, more robust 650V and 800V MOSFETs

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By eeNews Europe



ST’s advanced PowerFLAT 5×6 HV and PowerFLAT 5×6 VHV packages provide the large insulation path lengths and clearances required for operation at up to 650V or 800V, within the same 5 x 6 mm footprint of a standard 100V PowerFLAT 5×6. This is 52% smaller than the DPAK footprint. In addition, the package is only 1mm high and features a large exposed metal drain pad that maximises heat dissipation into pc-board thermal vias. This increases high-voltage capability, ruggedness, reliability, and system power density.

Three 650V MDmesh V MOSFETs in the PowerFLAT 5×6 HV package are priced from $2.20 (1000) for the STL12N65M5, and four 800V SuperMESH 5 MOSFETs in the PowerFLAT 5×6 VHV package, which is optimised for very high voltage ratings are priced from $1.50 for the STL2N80K5. Also sampling are two 600 V fast-switching MDmesh II Plus low Qg MOSFETs in PowerFLAT 5×6 HV.

ST; www.st.com/mosfet

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