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There are 3370 results for 3d-packaging

Lessengers starts production of 800G transceivers
Lessengers starts production of 800G transceivers
New Products | - By Nick Flaherty
...Kozlov, CEO and Founder of LightCounting. “New designs of pluggable and co-packaged optical engines rely on high density parallel…
CEO interview: Dr Adam Carter of photonic chip designer OpenLight
CEO interview: Dr Adam Carter of photonic chip designer OpenLight
Interviews | - By Nick Flaherty
...the end customer and we ere working on how to expand our menu of foundry partners and our menu…
Startup TeraSi raises funds for terahertz passives, packaging
Startup TeraSi raises funds for terahertz passives, packaging
Business news | - By Peter Clarke
...our technology offers the best combination of performance, compactness and volume scalability and solves the packaging and integration bottleneck…
TRUMPF, KDPOF show first 980nm multi-gigabit interconnect system for automotive
TRUMPF, KDPOF show first 980nm multi-gigabit interconnect system for automotive
Technology News | - By Nick Flaherty
...implementing state-of-the art optical data communication standards and solutions for the automotive industry. KDPOF to set up photonic packaging…
Intel begins EUV lithography of ‘Intel 4’ process in Ireland
Intel begins EUV lithography of ‘Intel 4’ process in Ireland
Business news | - By Peter Clarke
...rolls first tool into Fab 34 China’s synchrotron EUV lithography light source is no sanctions buster Intel tips glass…
Synopsys, Cadence expand 3D Blox 2.0 support for chiplet designs
Synopsys, Cadence expand 3D Blox 2.0 support for chiplet designs
Business news | - By Nick Flaherty
...and Product Management for the EDA Group at Synopsys The Cadence Integrity 3D-IC Platform includes Allegro X packaging technologies…
Drawing LEDs on your shirt
Drawing LEDs on your shirt
Technology News | - By Wisse Hettinga
...This work offers a route to the integration of perovskite optoelectronics in low-cost and large-area application scenarios such as…
Analog IP for 5nm automotive designs
Analog IP for 5nm automotive designs
New Products | - By Nick Flaherty
...at IFS. “Our advanced processes & packaging technologies and resilient supply chain, combined with Analog Bits PCIe SERDES IP,…
Micron breaks ground on US$2.75 billion Indian chip packaging fab
Micron breaks ground on US$2.75 billion Indian chip packaging fab
Business news | - By Peter Clarke
...has its own interest in chip packaging and wafer fabs (see Tata cleared to create chip packaging plant: report…
GlobalFoundries secures next 10-year DoD contract
GlobalFoundries secures next 10-year DoD contract
Business news | - By Peter Clarke
...billion Singapore wafer fab GloFo, ST finalize terms for €7.5 billion wafer fab at Crolles SkyWater awarded US$99 million…


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