CEA-Leti, coordinator of the pan-European consortium EuroCPS, has announced that the 15 partners have set up the goals of their collaborative project to establish a network of design centres to help SMEs and large companies develop innovative products for emerging Internet of Things (IoT) markets. The group will use proven cyber-physical system (CPS) platforms and cooperation with research technology organisations (RTOs) or technology transfer-oriented university institutes who bring together a spectrum of technical and application knowledge to support innovation.
EuroCPS members are major European system suppliers, world-class research centres and technology providers, all rooted in the top European regional ecosystems. (see member list, next page)
Funded by the European Commission, the three-year, €9.2 million project is designed to help innovators (SMEs and large companies) overcome barriers they face when entering new markets because they lack both knowledge of the value chain and the skills to master the entire design process from ideas to products. EuroCPS partners will provide technical expertise, coaching and access to advanced industrial cyber-physical system platforms to get innovators up to speed on the innovation ecosystem of “smart” products by facilitating access to the latest technologies and their implementation. In the process, it will offer all the necessary expertise and competencies to provide innovators from any sector with a smooth path to building innovative CPS-enabled systems. It also will tap existing regional ecosystems in several countries to bring the full value chain – from hardware/software platforms to cyber-physical systems – to high value-added products and services.
One key goal of the project is to link software, system and nano-electronic industries along the full CPS value chain to demonstrate a new cooperation model. This will be demonstrated by 30 novel industrial experiments funded through three open calls for developing innovative CPS products that will help increase the competitiveness of the European innovative companies. The targeted products will be designed, constructed and built on the EuroCPS Platforms:
· Avionics platform provided by Thales
· Connectivity platform provided by Schneider
· INEMO platform provided by STMicroelectronics
· Integrated and open platform provided by AVL
· Power management platform provided by Infineon
· Quark platform provided by Intel
· Silicon processes and package technology platform provided by STMicroelectronics
· STM32F platform provided by STMicroelectronics
next page; consortium members…
EuroCPS Project members:
· CEA-Leti, coordinator (France)
· CEA-List (France)
· STMicroelectronics Grenoble 2 SAS (France)
· Thales SA (France)
· AVL LIST GmbH (Austria)
· Infineon Technologies Austria AG (Austria)
· Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung E.V. (Germany
· The Digital Catapult (UK)
· Alma Mater Studiorum – University of Bologna (Italy)
· Lulea Tekniska Universitet (Lithuania)
· Budapesti Muszaki es Gazdasagtudomanyi Egyetem (Hungary)
· Intel Shannon Limited (Ireland)
· Schneider Electric Industries SAS (France)
· Vereniging High Tech NL (The Netherlands)
· Finepower GmbH (Germany)
· STMicroelectronics SRL (Italy)
EuroCPS aims to significantly reduce development time and certification efforts, thus putting Europe at the cutting edge of CPS development and implementation. It will do this through pan-European collaboration and knowledge exchange and access to the strong value chain in the strategic sector.
EuroCPS is part of the Smart-Anything-Everywhere Initiative under Horizon 2020 Leadership in Enabling Industrial Technologies which aims to generate new and breakthrough technologies, boost competitiveness, create jobs and support growth by offering a European-wide network of design centres. A first group of four innovation actions will combine efforts under the €25m funding budget to support around 100 industrial experiments with the aim of involving more than 200 SMEs and midcaps in the field of cyber-physical systems (CPS), Internet of Things (IoT) and smart systems integration (SSI).
CEA-Leti (France); www.leti.fr