Partnership to develop next-generation AI chiplet
CoAsia SEMI, a system semiconductor design specialist subsidiary of CoAsia, is supporting the development of a next-generation AI chiplet and software for data centres by providing its advanced packaging technologies to Rebellions, a Korean AI semiconductor unicorn.
Rebellions and CoAsia SEMI have signed an agreement for the development of a new chiplet package based on REBEL, Rebellions’ next-generation AI chiplet.
The two companies first collaborated in April by jointly securing a national project to develop a multi-petaflops PIM server chiplet. The new joint development agreement marks a deeper level of collaboration aimed at commercialising data centre products. It will incorporate CoAsia SEMI’s expertise in 2.5D silicon interposer, advanced package development, and manufacturing technologies. Compared to conventional single SoC architectures, chiplet-based designs offer superior design flexibility, yield, and optimisation in power and performance, making them a core technology for AI and HPC servers in data centres.
The companies expect to complete development and verification by the end of 2026 and plan to supply large-scale production volumes to domestic and global AI data centres.
This collaboration also includes participation from global OSAT (Outsourced Semiconductor Assembly and Test) and IP leaders. It aims to establish a complete ecosystem for addressing the global AI semiconductor market. With the completion of a comprehensive global semiconductor value chain encompassing fabless design, packaging, OSAT, and IP, the companies aim to lay the foundation for expansion into major AI/HPC markets, including the United States, Europe, and Japan.
This collaboration with CoAsia SEMI involves the joint development of an expanded heterogeneous chiplet-based product that builds upon the REBEL architecture and incorporates I/O dies and HBM3E.
REBEL is a chiplet-based AI accelerator engineered specifically for data centre-scale workloads. It is designed from the ground up for exceptional efficiency, high hardware utilisation, low latency, and seamless scalability.
Equipped with 144GB of HBM3e memory, it delivers an impressive 1 PFLOPS of FP16 compute power within a 350 W power envelope. REBEL also leverages the UCIe-Advanced specification for ultra-high bandwidth density, near-zero latency, and remarkable energy efficiency. Following REBEL, Rebellions is introducing advanced derivatives that leverage its chiplet-based architecture for seamless heterogeneous integration. These derivatives add I/O dies, enhanced memory capacity, and integrated CPU functionality.
“This collaboration is part of Rebellions’ strategy to diversify its AI semiconductor product lineup in response to the rapidly evolving AI market,” said Sung Hyun Park, CEO and Co-founder of Rebellions.”
“It signals the full-scale application of REBEL’s chiplet architecture and CoAsia SEMI’s advanced packaging capabilities. Through strategic collaboration with key partners like CoAsia SEMI, we will build the next-generation packaging ecosystem that goes beyond development and leads to mass production and commercialisation.”
DS Shin, CEO of CoAsia SEMI, stated, “The strategic technical collaboration between CoAsia SEMI and Rebellions — which brings together design, packaging, and software technologies — will play a pivotal role in shaping the AI semiconductor ecosystem.”
“Following this agreement, we plan to expand development and mass production supply with a Tier-1 AI customer in the United States soon, and will continue to secure our technological leadership in the fast-growing global AI semiconductor market.”
https://rebellions.ai
www.coasiasemi.com
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