PCB prototyping and production laser cutting and structuring system
The latest version even enables high-precision structuring of laminated PCB materials. The LPKF MicroLine 6000 P UV laser cutting system has been completely revised and now features a more ergonomic user interface design, an extended part detection system, and automated beam correction. Power sensors record and, if necessary, adjust the laser energy at the material surface. Positional corrections compensate for deviations in the laser beam through active elements in the beam path. This lessens environmental effects during machining and ensures a continuously high level of precision. Time-consuming calibration during commissioning and component replacement is no longer necessary, this task is now performed by the laser system. The LPKF MicroLine 6000 S laser depaneling system accurately cuts assembled boards out of a panel without mechanically or dynamically loading the delicate structures or components.
Visit LPKF Laser & Electronics AG at www.lpkf.com
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