PCB technology enables high currents on densely populated boards
According to Würth, the partial thick copper technology has shown good results, when high current is required on some parts of the PCB and complex control electronics in other parts. For the design of a printed circuit board, there are multiple important aspects to take into account. Among others, current and maximum temperatures play a key role.
Modern components require higher currents if they are to be incorporated into a circuit board. These currents generate higher temperatures on the circuit board and in the surrounding environment – a critical aspect for heat sensitive components. In addition, devices are getting smaller, but are simultaneously taking on ever more comprehensive tasks. This means less space for more complex control electronics.
Modern circuit boards must therefore overcome all the different challenges: a compact PCB must safely carry high currents and as many fine pitch tracks as possible. With the Wirelaid technology, designers can increase the copper cross section at certain points while maintaining a low layer count for the board. This reduces the volume and can simultaneously meet the current and heat dissipation requirements.
Wirelaid production is rather straightforward: Silver plated copper wires are fixed onto a copper foil using welding points and then pressed using standard production processes together with the printed cir-cuit board substrate – that’s all.
Würth Elektronik has created a Wirelaid design guide for customers explaining the spacing and dimensions that should be used. The design guide also contains an overview of the current carrying capacity of the different wire sizes. The company is currently working with 1.4 mm and 0.8 mm thick copper wires that are embedded either on the outer or inner layers of the board. The partial thick copper technology can be used in many high-current applications, from drive technology to engine electronics and inverters.
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