Peregrine expands integrated-RF-device coverage from DC to X-band
Peregrine has added two integrated products—a true DC switch and an X-band core chip. Built on its UltraCMOS technology, both products integrate RF, digital and analogue components onto a single chip. While integration has traditionally offered high-volume markets the benefit of lower cost, Peregrine uses intelligent integration to offer performance advantages in high-performance markets. Peregrine’s integrated products claim benefits such as configurability, flexibility, reliability, repeatability, ease-of-use, a reduced form factor and enhanced performance.
Low-frequency intelligent integration: a true DC switch
At the lower end of the frequency spectrum, Peregrine says it has set a new standard with the first RF integrated switch to achieve true DC capability. With a frequency range of 0 Hz to 8 GHz, the UltraCMOS True DC switch (PE42020) effectively operates in a previously unobtainable portion of the frequency spectrum. This frequency expansion is paramount to markets that rely on accuracy and precision, such as test and measurement. The True DC SPDT switch features high power handling, 30 dBm at 0 Hz and 36 dBm at 8 GHz, and maintains RF performance and linearity from DC through 8 GHz. Moreover, it can switch DC and AC peak voltages in the range of +10V to -10V at currents of up to 80 mA, a first for this kind of product.
On a single chip, the True DC switch integrates high-performance RF switching, DC tracking (an analogue function), and digital control logic and impedance control (50-Ohm absorptive or open reflective).
An advantage of the True DC switch is efficient switching time. While low-frequency operation typically requires a slow switching time, the True DC switch uses advanced circuitry to remove this dependence, resulting in a 10 µsec switching time, and a 15 µsec settling time which is critical for test-and-measurement applications.
The PE42020 features high-linearity (IIP3) performance of 63 dBm, and port-to-port isolation of 37 dB @ 6 GHz. It supports standard +1.8V and +3.3V control logic and operates over a temperature range of -40 to +85C. The True DC switch also supports 1000V HBM ESD tolerance and is supplied in a 20-lead 4 x 4 mm QFN plastic package.
X-band core chip
At the higher end of the frequency spectrum, Peregrine says it has the first integrated X-band, CMOS core chip to use MMIC (monolithic microwave integrated circuit) design techniques, enabling highly accurate signal control with minimal power loss. MMIC design techniques, such as Lange couplers, have previously only been used in III-V technologies. The use of these passive techniques on silicon has always presented a challenge due to silicon’s lossy nature at higher frequencies. Peregrine solves this challenge by using an UltraCMOS sapphire substrate—a near-perfect insulating substrate that lends itself to integration. With this X-band core chip, Peregrine combines standard CMOS design with passive MMIC circuitry for a truly intelligent approach to integration at microwave frequencies.
TheX-band core chip integrates the following on a single die: a seven-bit digital phase shifter; a seven-bit digital step attenuator; high isolation signal-path switching; and a compact digital serial interface control with true CMOS compatibility.
Sampling in early 2015, this X-band core chip delivers the fine resolution and degree of control that is critical for radar applications. The chip offers a maximum power handling of +18 dBm from 9-10.1 GHz and covers 31.75 dB attenuation range in 0.25 dB steps. The phase shifter offers 358 degrees of phase range with a resolution of 7 degrees. It maintains high attenuation and phase accuracy over frequency and temperature and exhibits low power consumption.
Peregrine Semiconductor; www.psemi.com/intelligentintegration
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