Peregrine Semiconductor introduces RF SOI 300 mm technology platform
By moving to a 300 mm wafer, Peregrine opens the door to new enhancements and advanced features in future generations of the UltraCMOS technology platform, which can leverage the GlobalFoundries 300 mm production-proven design enablement and manufacturing expertise and scale.
To develop the next-generation UltraCMOS 11 platform, Peregrine collaborated with tier-one fab GlobalFoundries. UltraCMOS 11 technology uses a custom fabrication flow from the GlobalFoundries state-of-the-art Fab 7 facility in Singapore.
The UltraCMOS 11 platform will be the foundation for Peregrine’s high volume mobile products and SOI products for other applications. It builds on the success of the award-wining UltraCMOS 10 technology platform, also developed and manufactured by GlobalFoundries.
“For over 25 years, Peregrine has been at the forefront of advancing RF SOI technology,” said Jim Cable, CEO of Peregrine Semiconductor. “That legacy continues with today’s introduction of the UltraCMOS 11 platform, the first RF SOI 300 mm technology platform. By using 300 mm wafers, Peregrine ensures our technology roadmap will continue to be on the leading edge of RF SOI.”