Performance boost for Bluetooth LE 5.3 with dual M33 cores

Performance boost for Bluetooth LE 5.3 with dual M33 cores

New Products |
By Nick Flaherty

Infineon Technologies has launched its first low power Bluetooth system on chip (SoC) to use the ARM Cortex M33 core for high performance alongside a core optimised for low power.

Launched at CES 2022, the AIROC CYW20829 Bluetooth LE SoC is a Bluetooth 5.3 core spec-compliant device for IoT, smart home and industrial applications. The chip is designed to support the entire spectrum of Bluetooth Low Energy (LE) use cases for home automation, sensors, lighting, Bluetooth Mesh, remote controls and any other Bluetooth LE-connected IoT application.

The chip integrates a power amplifier with 10 dBm of transmit output power and has receive sensitivity of -98.5 dBm for LE, -106 dBm for LE-LR 125 Kbit/s links and 100 dBm for 500 Kbit/s, providing the best link budget in the AIROC Bluetooth portfolio.

The Bluetooth LE subsystem is architected for low current consumption with a highly optimized radio and an ARM Cortex M33 core focused as the Bluetooth controller. A second M33 with a floating-point unit is dedicated for customer applications and can be clocked up to 96 MHz to provide high performance compute at low power.

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The application sub-system is highly integrated with configurable serial communication blocks that can be turned into UART/I 2C/SPI as needed, multiple timer/counter pulse-width modulators, I 2S, PDM, CAN and LIN interfaces. Security is built into the platform architecture with a ROM based root of trust, a TRNG, eFuse for custom keys and cryptography acceleration. For added flexibility, AIROC CYW20829 also supports XIP from external flash as well as encryption on the fly for content on the flash.

“With Infineon’s AIROC CYW20829 Bluetooth LE SoC, designers won’t have to choose between low power and high performance,” said Sonal Chandrasekharan, Vice President of the Bluetooth product line at Infineon. “The device has been designed from the ground up with efficient peripheral design, low leakage silicon with scalable and efficient MIPS, and a low power Bluetooth radio. The solution offers superior RF performance for reliable, robust connections, enabling the best user experience in the latest smart, connected devices.”

The AIROC CYW20829 is supported by ModusToolbox software and tools enabling rapid development of Bluetooth enabled IoT designs and the chip is currently sampling to select customers.

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