Phoenix contact offers connector/heatsink housing fillers
For the ICS series modular electronics housings from Phoenix Contact, fillers in depths of 67.5, 90, and 112.5 mm are now also available. They are available with or without vents in gray, black, blue, and yellow.
The new fillers extend the variety of connection technology that can be used. They can be individually processed for a customer-specific connection technology. The deeper fillers enable time- and cost-optimised mounting.
The new fillers can be used in the ICS 20, 25, and 50 housings. The ICS housing system can be used flexibly due to the modular system and the modularity of the connection technology. Stable guide rails enable quick and easy push-in mounting of assembled printed circuit boards. The design, colors, and printing of the housings can also be customised via an online configurator.
Phoenix Contact also provides various heatsink fillers for ICS series electronics housings. Space saving heatsink fillers enable heat dissipation wherever needed. There is also a wide range of passive heatsinks available for use in devices in thermally demanding applications.
The position of the heatsink base is variable to enable electronic components with an install height of up to 13 or 15 mm to be connected. The clearance between the PCB and the heatsink base is between 0 and 11 mm, depending on the space required. The heatsink is custom-designed and manufactured for the respective layout of the electronics. This application-specific design ensures optimum device heat dissipation and thus a longer service life for the electronic components.
The new ICS heatsink fillers complement the existing range of heatsinks and thermal simulations. Phoenix Contact provides a web-based, intuitive platform for the thermal assessment of electronic devices in the early stage of development. On request, this digital service can be extended to include individual consultations. Device developers benefit from detailed, application-specific simulation and a recommendation for the appropriate housing selection, heatsink design, and heatsink arrangement.
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