Photorelays deliver 3.75kV of isolation up to 110°C
Rated for operation at up to 110°C, the devices can replace mechanical relays in factory automation, battery management systems (BMS), or telecommunication equipment. The photorelays use multi-chip technology and were developed as high specification, pin-compatible versions of Toshiba’s existing 2.54SOP package products, the TLP172A and TLP172G. A double-mould structure improves minimum voltage isolation to 3750Vrms against the 1500Vrms of existing products.
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