Photoresist adhesion pre-treatment for dry film and liquid photoresist
14.00
This two- to three-step, low temperature micro-etching process creates a high level of uniform roughness and is suitable for horizontal processing. It is claimed to support a cost-efficient chemistry with considerable yield improvements.
Besides a high copper loading capacity of up to 40 g/L, the process only requires a minimal etch depth of 0.5 to 1.0 microns. The robust process further features a wide chloride operating window and tolerance (up to 20 ppm), making it an easy to control and stable process, says the manufacturer.
The new process is claimed to enable a simplified waste treatment, which leads to lower production costs, with yield improvements of 7% to 10% over competing solutions.
Visit Atotech at www.atotech.com
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